Services

    Services

  • WLCSP Backend Turnkey Service: with WL Test and DPS(Die Processing Service)
      WL Test:
    • Test software and hardware development
    • Probe card design and maintenance
    • Program transfer and debug
    • Test solutions for RF, logic, power and analog
  • DPS (Die Processing Service):
      The below processes are available, and the order is flexible.
    • Class 1K Clean Room Environment
    • Automated Wafer Transfer
    • 8 " and 12 " Wafer Capability
    • AOI for IQC (Wafer form)
    • Backgrind
    • Backside Laminate (Black)
    • Laser Mark
    • Singulation
    • Package Saw
    • AOI Die Inspection (Frame form)
    • Automated Pick & Place
    • Automated Pick & Place with Full Test
    • Automated Mapping Check
    • Drop ship
  • Wafer Sorting
    • Nowadays, the IC features evolve rapidly, the previous tester is hard to meet the demand, therefore, ITS keep integrate the most advanced test platform from Teradyne、Advantest、Credence and Chroma to satisfy the diverse requirements from low-end to high-end application.
  • Final Test
    • Most package types are available.
    • Use the best handler in industry, and provide the best quality with highest production stability.