News Center

The red-hot WLCSP, ITS provides WLCSP backend turnkey service

Have you face the yield issue and low thorough-put in WLCSP development?
   Who can handle the backend grinding, testing, saw and packing after bumping?

When your company is trying to approach mobile and portable devices, and intend to meet the diversified Internet of Things (IoT) demand from WLCSP, you might encounter above questions.

Recently, IST received more and more WLCSP board level reliability (BLR) project, and we saw a rapid growing in terms of quantity and validation items. When we glance at the end-customers, we found the leading companies are constantly investing resources in WLCSP application. Therefore, WLCSP is no doubt about one of the most important packages for Internet of Things (IoT) market in the future.

Unlike conventional package, WLCSP package process is quite unique, once the ball-drop has been done, then directly moving to the backend process including Wafer Level Test and DPS (Die-Processing Service).

The most critical part is the DPS, In recent cases from IST WLCSP related analysis indicated that the root cause of RMA is usually from Open/Short or Chipping, obviously, there are many items can be improved in the DPS process.

In order to ensure the quality output and better thorough-put, ITS (Innovative Turnkey Service Corporation), subsidiary of IST, has built an advanced WLCSP Backend Turnkey Service, and collaborate with ITS reliability test, we are confident to deliver the best output, yield and quality.

In summary, the one-stop WLCSP backend turnkey service from IST and ITS able to:

  • Evaluate the optimized process to save the cost and keep the quality.
  • Provide sufficient mass production capacity.
  • Expertise analysis of market trend in WLCSP.
  • Innovative solution, Pick and Place with full test.
  • Solid Frame Test solution and Strip Test solution.
  • Timely and trust-worthy WLCSP reliability service provided by IST

For more information about one-stop WLCSP backend turnkey service, please click this link or reach:

Taiwan Contact: Roger│+886-911-834-306 │
Overseas Contact: Chris│+886-927-090-600 │

About ITS
ITS (Innovative Turnkey Solution Corporation) established in 2009, a subsidiary of IST (Integrated Service Technology), offers a variety of customized turnkey solutions for assembly and test customers. Thorough years of hard work, ITS has accumulated hundreds of customer and collaborated with worldwide IC design company. Now, we are confident to create more value and competitiveness for customers.

ITS has dedicated all efforts to deliver the most reliable and competitive turnkey services in wafer sort, In the future, we will keep develop various assembly and test patent portfolio, and utilize all technologies to meet customer expectation. These unique turnkey services have covered the analog, logic, MEMS and mixed-signal application.

In order to satisfy the demand of thinner and smaller for the mobile device and internet, ITS successfully built the most advanced WLCSP Backend Turnkey Service. Including Wafer Level Test and DPS (Die-Processing Service), by this backend service, we can shorten the cycle time and satisfy the capacity.

Back List